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The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. InterPACK is the flagship conference of the ASME Electronics and Photonics Packaging Division (EPPD), in technical cooperation with the Japanese Society of Mechanical Engineers (JSME). The international nature of the meeting has been highly beneficial in promoting global interactions between Industry, Research Labs, and Academia.
The conference series was founded in 1992 as the ASME-JSME Joint Electronic Packaging Conference and was renamed InterPACK in 1995. The InterPACK path-finding workshop (IPW) was held in June 2016, Silicon Valley, CA, USA, in an attempt to revamp and refocus the conference on the most pressing issues facing the InterPACK community. Please see pages 20-24 of the IPW 16 program. The InterPACK Advisory Committee (IAC) and EPPD Executive Committee decided in 2017 that InterPACK would be held annually going forward.
ASME is a not-for-profit membership organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines, toward a goal of helping the global engineering community develop solutions to benefit lives and livelihoods. Founded in 1880 by a small group of leading industrialists, ASME has grown through the decades to include more than 140,000 members in 151 countries.
For more than 100 years, ASME has successfully enhanced performance and safety worldwide through its renowned codes and standards, conformity assessment programs, training courses, and journals.ASME also produces nearly 40 international conferences. These industry-leading events feature advanced research and technical content spanning a range of industries impacted by mechanical engineering, including energy production, energy sources, advanced manufacturing, and engineering sciences.