Speakers - Keynote Luncheon


Wednesday, August 29, 2018

Masaru Ishizuka
Toyama Prefectural University
Tokyo, Japan


I am greatly honored to have received this wonderful award, “The Allan Kraus Thermal Management Medal. In this talk, I will describe the process of how I came to research the cooling of electronic equipment.

When I joined Toshiba in 1981, I was assigned to a group involved in thermal management of equipment and I knew that the study of cooling technology for electronic equipment had become very popular in the United States. At that time, Toshiba had focused on developing small laptop computers using small cooling fans. Therefore, as I was in the Research & Development center, and I indirectly became involved the small laptop computer project.

In addition, various developmental topics emerged from the manufacturing sites, but when I myself sought for research topics, I was at a loss what to do. I took a hint from someone that my research should focus on a very slow flow in a natural air cooled electronic equipment casings. Therefore, I began to evaluate the flow resistance coefficients of perforated plates used in the outlet vents of electronic equipment. I tried to obtain the flow resistance values of small velocity flows, using energy balance and buoyancy balance, and by this means. I obtained the resistance values for such perforated plates. I presented these results at the ASME Winter Annual Meeting, held in New Orleans in December 1984.

Through my participation in the conferences, I gained many valuable friends, such as, Dr. Wataru Nakayama and Avram Bar-Cohen. There are, I am afraid, too many to mention, but together they constitute a great treasure to me. After that, my research and development work has expanded, into fields such as the development of methods to apply thermal analysis to electronic equipment design, the development of cooling technology based on phase change, and so on. I have pursued applied research in these fields, and have studied the development of a self-cooling system utilizing low- temperature waste heat from electronic equipment.


Masaru Ishizuka is currently President of Toyama Prefectural University. He received a Ph.D. in Mechanical Engineering, from the University of Tokyo in 1981, joined Toshiba, and worked as "Toshiba Chief Thermal Architect". He has been a leading member of the Heat Transfer Field specializing in thermal design and management techniques for a wide spectrum of electronic systems. He joined Toyama Prefectural University in 2000 as an associate professor and took an office as a professor in 2003, the Dean of Engineering Faculty in 2011, President, 2013. Dr. Ishizuka is also actively in the development of practical thermal analysis approaches for being applied to various electronic equipment designs. His research resulted in several patents and over 250 technical publications. He serves on several editorial boards including ASME Journal of Electronic Packaging and has organized numerous conferences. He is a Fellow of ASME and JSME and has received numerous awards including the "2006 Outstanding Contribution Award, Heat Transfer Division, JSME and "2010 Outstanding Contribution Award, K-16 committee, ASME.