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Track 1: Challenges in Advanced Packaging for Harsh Environment Panel Tuesday, August 28, 2018 1:30 PM – 3:00 PM Room: Mason II, Second Floor
Abstract: Electronics packaging in harsh environments continues to be a key technological challenge that limits overall system performance and reliability in multiple applications despite advances in underlying technologies. This panel will bring together leading experts from academia and industry to present a perspective on key technological challenges as well as opportunities in this important direction. Industry panelists will specifically focus on case studies of advances in electronics packaging that have led to successful products. Panelists from academia will provide an overview of recent fundamental research advances in this field. The panel will also discuss harsh environment packaging in the context of the rapidly evolving supply chain environment in the microelectronics and MEMS industry.
Panelist Biographies
Dr. Ankur Jain, Moderator, University of Texas, Arlington, TX
Ankur Jain is an Associate Professor in the Mechanical and Aerospace Engineering Department at the University of Texas, Arlington, USA. He directs the Microscale Thermophysics Laboratory (www.uta.edu/mtl), which carries out experimental and theoretical research on heat transfer and energy conversion in Li-ion batteries, microscale thermal transport, bioheat transfer, microelectromechanical systems, etc. He received the Lockheed Martin Excellence in Teaching Award (2018), UTA College of Engineering Outstanding Early Career Award (2017), NSF CAREER Award (2016) and the ASME EPP Division Young Engineer of the Year Award (2013). Dr. Jain was among a small group of US-based researchers invited by the US National Academy of Sciences to participate in the 5th Arab-American Frontiers of Science, Engineering, and Medicine Symposium in 2017. He received his Ph.D. (2007) and M.S. (2003) in Mechanical Engineering from Stanford University, where he received the Stanford Graduate Fellowship (SGF) and his B.Tech. (2001) in Mechanical Engineering from the Indian Institute of Technology (IIT), Delhi with the highest GPA among the class of Mechanical Engineering. He has published 53 high quality journal articles on topics related to energy conversion and heat transfer in batteries, microelectronics and biological systems. His research has been supported by National Science Foundation, Department of Energy, Office of Naval Research, Indo-US Science & Technology Forum, etc.
Dr. Gamal Refai-Ahmed, Co-Moderator, Watson School of Engineering, Binghamton, NY
Dr. Gamal Refai-Ahmed, Life Fellow ASME, Fellow Canadian Academy of Engineering, is a Distinguished Engineer and Adjunct Professor in Watson School of Engineering and Applied Science SUNY Binghamton. He obtained the M. A. SC. and PhD degrees in Mechanical Engineering from the University of Waterloo. He is the author of more than 90 technical papers and more than 100 US patents/International Patents/ Pending patents. He is an Associate Editor of Journal Components and Packaging, IEEE and Journal of thermal Sciences and Engineering and Applications, Transactions of the ASME.
Dr. Pradeep Lall, Auburn University, Montgomery, AL
Pradeep Lall is the MacFarlane Endowed Professor in the Department of Mechanical Engineering and the Director of NSF Center for Advanced Vehicle and Extreme Environment Electronics at Auburn University. He serves on the Technical Council and Governing Council of NextFlex Manufacturing Institute. Dr. Lall is author and co-author of 2-books, 14 book chapters, and over 500 journal and conference papers in the field of electronics reliability, safety, energy efficiency, and survivability. Dr. Lall, a fellow of IEEE, fellow of the ASME, and fellow of the Alabama Academy of Sciences. Dr. Lall is recipient of the NSF’s Alex Schwarzkopf Award for Technology Innovation, Alabama Academy of Science Wright A, Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, SMTA’s Member of Technical Distinction Award, Auburn University’s Creative Research and Scholarship Award, SEC Faculty Achievement Award, Samuel Ginn College of Engineering Senior Faculty Research Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and Twenty Best-Paper Awards at national and international conferences. Dr. Lall has served in several distinguished roles at national and international level including serving as member of National Academies Committee on Electronic Vehicle Controls, Member of the IEEE Reliability Society AdCom, IEEE Reliability Society Representative on the IEEE-USA Government Relations Council for R&D Policy, Chair of Congress Steering Committee for the ASME Congress, Member of the technical committee of the European Simulation Conference EuroSIME, and Associate Editor for the IEEE Transactions on Components and Packaging Technologies.
Debbie G. Senesky, Stanford, University, Stanford, CA
Debbie G. Senesky is an Assistant Professor at Stanford University in the Aeronautics and Astronautics Department and by courtesy, the Electrical Engineering Department. In addition, she is the Principal Investigator of the EXtreme Environment Microsystems Laboratory (XLab). Her research interests include the development of micro- and nano-scale sensors, high-temperature wide bandgap & 2D electronics, and robust interface materials for operation within extreme harsh environments. In the past, she has held positions at GE Sensing (formerly known as NovaSensor), GE Global Research Center, and Hewlett Packard. She received the B.S. degree (2001) in mechanical engineering from the University of Southern California. She received the M.S. degree (2004) and Ph.D. degree (2007) in mechanical engineering from the University of California, Berkeley. She has served on the program committee of the IEEE International Electron Devices Meeting (IEDM), International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), and International Symposium on Sensor Science (I3S). She is currently co-editor for IEEE Electron Device Letters, Sensors (journal), and Micromachines (journal). She is a recipient of the NASA Early Faculty Career Award and Alfred Sloan Foundation Fellowship Award. More information about Prof. Senesky can be found at xlab.stanford.edu or on Instagram: @debbiesenesky.
Przemyslaw Gromala, Robert Bosch GmbH, Reutlingen, Germany
Mr. Przemyslaw Gromala is a simulation senior expert at Robert Bosch GmbH, Automotive Electronics in Reutlingen. Currently leading an international simulation team and FEM validation lab with the main focus on implementation of simulation driven design for electronic control modules and multi-chip power packaging for hybrid drives. His research activities focus on virtual pre-qualification techniques for development of the electronic control modules and multi-chip power packaging. His technical expertise includes material characterization and modeling, multi-domain and multi-scale simulation incl. fracture mechanics, verification techniques and prognostics and health management for future safety related electronic smart systems. Prior joining Bosch Mr Gromala worked at Delphi development Center in Krakow, as well as at Infineon research and development center in Dresden. He holds a PhD in mechanical engineering from Cracow University of Technology in Poland.
Mudasir Ahmad, Cisco Systems, Inc., San Jose, CA
Mudasir Ahmad is a Distinguished Engineer/Senior Director at Cisco Systems, Inc. He has been involved with mechanical design, microelectronics packaging design and reliability analysis for 17 years. He received his Bachelors from Ohio University, his M.S. degree in Mechanical Engineering from Georgia Institute of Technology and his Masters in Management Science & Engineering at Stanford University. Mudasir is leading the Center of Excellence for Numerical Analysis, developing new analytical/stochastic algorithms, experimental design and reliability characterization of next generation 3D packaging, System-in-Package Modules and Silicon Photonics. Mudasir is also involved with implementing IoT, Artificial Intelligence and Big Data Analytics to streamline Supply Chain Operations. Mudasir has delivered several invited talks on leading technology solutions internationally. Outside of Cisco, he is involved with programs at the Silicon Valley Chapter of the Components Packaging and Manufacturing Technology (CPMT) Society of the IEEE, and actively participates in IPC and JEDEC standards organizations. He was actively involved in the local CPMT chapter of IEEE for several years; holding the positions of Secretary, Vice Chair and Chair of the Chapter. Mudasir has over 30 publications on microelectronic packaging, two book chapters, and 13 US Patents. He received the internationally renowned Outstanding Young Engineer Award in 2012 from the IEEE.
Dr. Rajen Dias, Amkor Technology, Tempe, AZ
Dr. Rajen Dias is a Director of Advanced Products Development at Amkor Technology, USA responsible for developing and qualifying advanced packaging solutions such as 2.5D TSV technologies and large body FCBGA. Prior to Amkor, he was Principal Engineer at Intel’s Assembly Technology Development Quality & Reliability Group focusing on reliability and failure analysis of package pathfinding programs for computer, server and FPGA applications for 32 years. He did his undergraduate B.Tech. at Indian Institute of Technology, Madras, India and graduated with a MS and Ph.D in Materials Science from Lehigh University, Bethlehem, USA. He is past General Chair of the Electronic Components and Technology Conference (ECTC), published over 45 technical publications in packaging and has 32 patents.
Track 2 Panel: Data Centers and IT Management Date: Tuesday, August 28, 2018 Time: 3:15 PM – 4:45 PM Room: Mason I
Abstract: The panelists will present and discuss state of the art, challenges, opportunities and future directions for the thermal management of high power servers.
Panelists
Rahima Mohammed, Intel Corporation, Santa Clara, CA
Dr. Rahima Mohammed is a Senior Principal Engineer at Intel Corporation and currently leads the “Delight Customer Program Office” in the Performance, Power and Competitive Analysis team in Manufacturing Validation Performance (MVP) team of Intel.
Prior to this, she served as a Data Center Customer Solutions Technologist in Manufacturing Validation Engineering (MVE) and led the data mining efforts on customer returned parts. She has been with Intel over 19 years after graduate schooling from Yale. Before joining MVE, she served as the advanced test module technologist, path finding czar for strategic emerging technologies across market segments and also setup the innovation programs for the division. She also chairs various technical steering committees and serves on Industry advisory boards. She has published 100+ papers in Intel internal and external conferences and filed 5 patents. She serves as a reviewer for various conferences like ITherm, InterPACK, and a program committee member of IEEE Semi-therm conference and Burn-in-test strategies workshop. She served as the vice-program chair, program chair, and general chair of Semi-therm conferences in 2014, 2015, and 2016, respectively. Rahima has a strong passion for mentoring and coaching and hence, has served as the senior advisor for Women at Intel Network of Guadalajara, Mexico for the past 8 years, and a TechWomen technical mentor of 2011 and 2012. She has been working with GHC and AnitaB.
Dr. Amr Helmy, University of Toronto, Toronto, Ontario, Canada
Amr is a Professor in the department of electrical and computer engineering at the University of Toronto. Prior to his academic career, he held a position at Agilent Technologies, R&D division, in the UK between 2000 and 2004. At Agilent his responsibilities included developing InP-based photonic semiconductor integrated circuits and high-powered submarine-class 980 nm pump lasers. He received his Ph.D. and M.Sc. from the University of Glasgow with a focus on photonic devices and fabrication technologies, in 1999 and 1995 respectively. He received his B.Sc. from Cairo University in 1993, in electronics and telecommunications engineering science. His research interests include photonic device physics and characterization techniques, with emphasis on nonlinear optics in III-V semiconductors; applied optical spectroscopy in III-V optoelectronic devices and materials; III-V fabrication and monolithic integration techniques. Amr has served the community in numerous roles. He has served as Vice President Membership for the IEEE Photonics Society (2008-2010). He is currently the CLEO Program Chair (2018-2020), where he previously served as the chair for the Semiconductor Lasers committee. He also serves as the Technical Program Chair for IPC 2016-2018, where he previously served as the chair for the committees on Semiconductor Lasers, Optical Materials and Metamaterials as well as the committees on Photonic Integration and Packaging. He has served as an associate editor for the Photonics Journal and is currently an associate editor for Optics Express.
Track 3 Panel: Integration of Sensors with Flexible Systems for IIoT Wednesday, August 29, 2018 10:30 AM –12:00 PM Room: Mason II, Second Floor
Abstract: Industrial Internet of Things (IIOT) use cases require customized form factors to integrate sensing systems into the user’s unique workflows. These applications in structural monitoring, health care and industrial wearables impose challenging microelectronic packaging requirements. This multi-disciplinary panel will share their experience in research, technology development, design and systems integration related to these key challenges.
Panelist Biographies:
Panel Moderator: Valerie Marty, Connected Micro LLC, OR
Valerie Marty is the founder of Connected Micro LLC providing consulting services for research teams navigating commercialization challenges. Valerie contributed to the advancement of CMOS and MEMS technologies at Hewlett Packard as an R&D engineer and later became the Global Technical Communities Lead for HP Labs. In 2014, Valerie became a Hall of Fame Inductee within the MEMS & Sensors Industry Group and an alumni of the MSIG Technical Advisory Committee. Valerie holds an MS in Physical Chemistry from Oregon State University.
Jeff Bergman, Acellent Technologies, Sunnyvale, CA
Mr. Jeffrey Bergman is the Director of Engineering Marketing at Acellent Technologies Inc. He received a BSE from Calvin College and MSE degrees in both Civil and Electrical Engineering from the University of Michigan where he pursued graduate research in the field of Structural Health Monitoring (SHM) for bridges. Mr. Bergman has been engaged in his current role with Acellent Technologies since 2013 where he works on the development of SHM technology for application in a wide range of fields including: Oil & Gas, Aerospace, Defense, and Automotive. His work has been presented in over a dozen technical papers and presentations covering the development, testing and application of structural monitoring systems.
Dr. Mary Ann Maher, CEO of SoftMEMS LLC.
Mary Ann received her Ph.D. degree in 1989 from Caltech in the area of semiconductor device modeling. She then moved to the Swiss Center for Electronics and Microtechnology (CSEM) in Neuchatel, Switzerland. She joined Tanner Research in 1992 becoming the software architect for their IC design tools. She moved to MEMSCAP in 1999 as an Executive Vice President and became the company’s CTO in 2001. She founded SoftMEMS LLC in 2004 to address the need for co-design tools for systems incorporating MEMS sensors, electronics and packaging.
Dr. Janos Veres, Program Manager, Printed Electronics, PARC Flex, CA
Janos Veres leads PARC's Novel and Printed Electronics Program exploring the Future of Electronics. He is passionate about the future of manufacturing and the new ecosystems enabled by digital technologies. His main interest is exploring 2D and 3D printing and large area processes for electronic devices to merge form and function and to “free electronics from the box”. By combining novel materials, device designs and unique deposition processes, it becomes possible to print flexible circuits, sensors, memory and hybrid electronic systems. Janos creates projects that combine experts in technology, design, user experience and systematic innovation. Janos has held R&D, manufacturing and management positions in material, printing and electronics companies including PolyPhotonix, Kodak, Merck, Avecia, Zeneca and Gestetner. Janos holds a Ph.D. in Solid State Electronics from Imperial College, London.
Dr. Benjamin Leever, Soft Matter Materials Branch, Air Force Research Laboratory, OH
Benjamin is currently a Senior Materials Engineer AFRL Soft Matter Materials Branch. His primary roles are Advanced Development Lead and Government Chief Technology Officer of NextFlex, a $170M public-private partnership established to create a domestic manufacturing ecosystem in flexible hybrid electronics. He earned a B.S. in Chemical Engineering from the University of Cincinnati and a Ph.D. in Materials Science & Engineering from Northwestern University.
Tracks 4 & 5: Vehicular Power Electronics Wednesday, August 29 2018 3:15 PM– 4:45 PM Room: Jackson, Second Floor
“Automotive Power Electronics: The New Challenges of Wave #3”
Abstract: Automotive electronics represents the third wave of electronics most prominently. Power electronics is heterogeneously integrated together with various sensor and communication technologies into highly miniaturized units. These systems are exposed to harsh field conditions, yet need to show highest reliability and functional safety. They must be fabricated with maximum efficiency in order to find their intended mass market. Then, the impact of these products on the lives of the people around the globe will be as fundamental and disruptive as it has been of the personal computers (wave 1) and the smart phones (wave 2).
After a brief survey on these effects, the joint panel of InterPACK, Tracks 4 & 5, will discuss various aspects and contributions that allow coping with the great engineering and research challenges related to this new wave of electronics technologies.
Sven Rzepka, Moderator
Sven Rzepka is head of the Micro Materials Center (MMC) at Fraunhofer ENAS and professor for 'smart systems reliability' at TU Chemnitz, Germany.
He joined Fraunhofer in 2009 after working as Principal simulation at Qimonda and Infineon. In 2002, he graduated from Dresden University of Technology with PhD and habilitation degrees. Dr. Rzepka has been working in Backend and BEoL technologies for 30 years with 25 years experience in microelectronics and smart systems reliability and simulation. He has published his engineering work in more than 150 papers and technical talks around the world. He is involved in international conference committees and organizes the annual European Expert Workshop on Reliability of Electronics and Smart Systems (EuWoRel). Prof. Rzepka is member of IEEE for 28 years, and Euceman for 9 years, and ASME. Serving as member of the Executive Committee of the European Technology Platform EPoSS, he has frequently be involved in evaluation, road mapping, and policy making processes advising European Commission and national authorities.
Sukwon Choi, Moderator
Sukwon Choi is currently an assistant professor of mechanical engineering at the Pennsylvania State University. He received the B.S. degree in mechanical engineering (2005) and M.S. degree in automotive engineering (2007) from Hanyang University, Seoul, Korea. He received the Ph.D. degree in mechanical engineering from Georgia Institute of Technology (2013). He continued research at Sandia National Laboratories as a postdoctoral appointee in the Microsystems Science and Technology Center (2013-2015). His research is currently focused on the study of high-power ultra-wide bandgap electronics and low-poawer devices based on two-dimensional layered materials.
Dr. Lauren Boteler leads the thermal and packaging research programs as part of the Advanced Power Packaging group at the U.S. Army Research Laboratory (ARL). She received her B.S. and Ph.D. degrees in mechanical engineering from the University of Maryland in 2006 and 2011, respectively. Her work at ARL, beginning in 2005, has focused on electronics packaging and thermal management solutions for a wide range of Army applications. She designs thermal and packaging solutions including 3D chip stacking, power electronics, RF HEMT devices, top side cooling, phase change materials, additive manufacturing, MEMS, and thermoelectric modules. More recently, she has initiated a research program in Advanced Power Electronics Packaging and Thermal Management which focuses on four main challenges of power electronics packaging: transient thermal mitigation, additive manufacturing, coengineering/codesign, and high-voltage packaging.
Dr. Gereon Meyer, Head of Strategic Projects with the Future Technologies and Europe Department of VDI/VDE Innovation + Technik in Berlin, Germany
Dr. Gereon Meyer is leading a team of experts concerned with future trends in transportation and the enabling role of smart electronic systems. He is the rapporteur for research and innovation roadmaps on the electrification and automation of road transport on behalf of public authorities, industry and academia, in particular the European Technology Platform on Smart Systems Integration (EPoSS). Moreover, he is the chairman of the International Forum on Advanced Microsystems for Automotive Applications (AMAA), and the editor of the Springer book series Lecture Notes in Mobility.
Dr. Martin Niessner received his Ph.D. in electrical engineering with first class honors from Technische Universitaet Muenchen (TUM), Munich, Germany.
From 2006 to 2012, he was a researcher and teaching assistant with the MEMS group of Dr. Habil. G. Schrag and Prof. G. Wachutka at TUM, focusing on the systematic characterization and physics-based multi-energy-domain coupled simulation of MEMS devices. Since 2012 he is with the package simulation team at Infineon Technologies AG, Neubiberg, Germany. His work focuses on reliability prediction, material characterization, material modeling and standardization (JEDEC/IPC-9301 guideline) in the field of microelectronics packaging.
Dr. Ercan M. Dede received his B.S. degree and Ph.D. in mechanical engineering from the University of Michigan and an M.S. degree in mechanical engineering from Stanford University. Currently, he is a Senior Research Manager in the Electronics Research Department at the Toyota Research Institute of North America. His group focuses on vehicle systems involving sensors, power semiconductors, advanced circuits, packaging, and thermal management technology. He has over 55 issued patents and has published more than 50 articles in archival journals and conference proceedings on topics related to design and structural optimization of thermal, mechanical, and electromagnetic systems. He is an author of a book entitled, ``Multiphysics Simulation: Electromechanical System Applications and Optimization.'' His team has received two R&D 100 Awards for the development of technologies related to next-generation power electronics for electrified vehicles.
Dr. Klas Brinkfeldt received his PhD from the Swedish Institute of Space Physics, Umeå University, Sweden in 2006. He has worked on sensors and instrumentation for European space projects and MEMS devices for particle measurements in space. He has also worked in the automotive industry mainly with the electrical systems of Volvo cars. Since 2009 he works at the Swedish research institute Swerea IVF where his research focus is packaging and reliability of power electronics and sensors for harsh environments.
Women in Engineering Panel Tuesday, August 28, 2018 4:15 PM – 6:45 PM Room: Sansome, Second Floor
Abstract: The Panel on “Women in Engineering” will be composed of exemplary female educators and industry/lab leaders who will discuss their career paths and challenges as well as their advice to younger females. The panel will have representation from a wide range of educators from university level and leaders from related industries and government labs. All female graduate students, and particularly those who participate in the graduate student poster session, will be strongly encouraged to attend and learn about potential careers in academia, industry and government institutions. The panel will be beneficial to young female engineers and university faculty as well. In addition, the event will be useful to graduate students and attendees (industry, government, and academia) of both genders.
Leila Choobineh is an assistant professor of Mechanical Engineering at SUNY Polytechnic institute.
She received the Ph.D. degree (2014) in mechanical engineering from the University of Texas at Arlington. Her research interests include the development of micro- and nano-scale sensors, thermal management of 3D integrated circuits, microelectronics, flexible electronics, and microelectronics cooling. She had served as session chair, topic chair and track chair at IMECE, IEEE ITherm and InterPACK conferences during the last three years.
Amy Marconnet is an Assistant Professor of Mechanical Engineering at Purdue University.
She received her B.S. in Mechanical Engineering from the University of Wisconsin – Madison in 2007, and her M.S. and PhD in Mechanical Engineering at Stanford University in 2009 and 2012, respectively. She then worked briefly as a postdoctoral associate at the Massachusetts Institute of Technology, before joining the faculty at Purdue University in August 2013. At Purdue University, the Marconnet Thermal and Energy Conversion (MTEC) lab integrates metrology and analysis of underlying transport mechanisms with design and development of nanostructured materials.
Vidyu Challa is Technical Director at DfR Solutions
Vidyu Challa is Technical Director at DfR Solutions, where she helps customers prevent battery problems from happening. Dr. Challa works on a range of battery challenges including design reviews, manufacturing audits, supplier qualification and root cause analysis. She spent several years in the battery industry, developing custom battery solutions for IOT and smart medical devices. She obtained a Ph.D. from the University of Maryland, where her work was focused on the reliability of electronic components and systems. She has broad based expertise that includes engineering technology start-up experience, product development, R & D, and various roles in marketing and business development. Dr. Challa has published her work in journals, presents at conferences and frequently writes blog articles. As a battery expert, Dr. Challa teaches battery workshops at several industry conferences and Fortune 500 companies.
Debbie G. Senesky is an Assistant Professor at Stanford University in the Aeronautics and Astronautics Department and by courtesy, the Electrical Engineering Department.
In addition, she is the Principal Investigator of the EXtreme Environment Microsystems Laboratory (XLab). Her research interests include the development of micro- and nano-scale sensors, high-temperature wide bandgap & 2D electronics, and robust interface materials for operation within extreme harsh environments. In the past, she has held positions at GE Sensing (formerly known as NovaSensor), GE Global Research Center, and Hewlett Packard. She received the B.S. degree (2001) in mechanical engineering from the University of Southern California. She received the M.S. degree (2004) and Ph.D. degree (2007) in mechanical engineering from the University of California, Berkeley. She has served on the program committee of the IEEE International Electron Devices Meeting (IEDM), International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), and International Symposium on Sensor Science (I3S). She is currently co-editor for IEEE Electron Device Letters, Sensors (journal), and Micromachines (journal). She is a recipient of the NASA Early Faculty Career Award and Alfred P. Sloan Foundation Fellowship Award. More information about Prof. Senesky can be found at xlab.stanford.edu or on Instagram: @debbiesenesky.
Judy Priest is a Distinguished Engineer in the Chief Technology and Architecture Office at Cisco Systems.
She explores emerging technologies and architectures impacting strategic product areas by developing proof of concepts for assessments, such as IoT, AI, and blockchain. Judy has over 30 years of experience in applied electromagnetics used in high speed signaling and optics for silicon and data center products. She has worked in circuit and interconnect design, ASICs and packaging, and system architectures for microprocessors, compute, storage, graphics, and network switch platforms. Judy is a recognized industry expert and is frequently invited to speak at international electronics and packaging conferences, and has participated in several IEEE and JEDEC standards committees. Judy has been at Cisco for 15 years, and previously worked at Digital Equipment Corporation, Hewlett Packard, Silicon Graphics, and Atheros Communications, as well as startup ventures. Judy has chaired the Industry Advisory Board for GHC (Grace Hopper Celebration), and chaired conference session committees on IoT and HCI. Judy is the Executive Technical Advisor for Cisco’s WISE (Women in Science and Engineering), focusing on the recruitment, development, and advancement of technical women.
Dr. Melissa Grupen-Shemansky is the Chief Technology Officer at SEMI for flexible electronics and advanced packaging.
Dr. Grupen-Shemansky directs R&D consortia and SEMI governing and technical councils comprised of government, industry, and university experts. Melissa has over 25 years of experience in the semiconductor industry at various levels of management in research and development, manufacturing, business development, and technology strategy. Melissa began her career at Motorola, Semiconductor Products Sector and subsequently worked at Lucent, Bell Labs as Director of Interconnect and Design, and AMD/Spansion as Vice President of Packaging and Interconnect Technology. Prior to joining SEMI, Dr. Grupen-Shemansky was the Senior Vice President of Engineering for Advanced Nanotechnology Solutions, Inc, a startup in 3D ICs and cybersecurity. She serves on the Advisory board for BRIDG in Neo City, FL. Dr. Grupen-Shemansky holds both bachelor’s and master’s degrees in Chemical Engineering from Pennsylvania State University and a Ph.D. in Chemical Engineering from Arizona State University. She has received various corporate and educational awards, has seven issued patents, numerous technical publications, and is a contributing author to Failure-Free Integrated Circuit Packages.
Moderators
Dr. Bahgat Sammakia, Moderator, Binghamton University, State University of New York, Binghamton, NY
Bahgat Sammakia, a SUNY distinguished professor of mechanical engineering, is the Vice President for Research at Binghamton University. He is the founding director of the Small Scale Systems Integration and Packaging Center, a New York State Center of Excellence, and is the director of the Energy Efficient Electronic Systems Center, an NSF IUCRC founded in 2011 with a focus on reducing the energy consumed by data centers around the world. Sammakia served as the interim president of SUNY Polytechnic Institute from December 2016 to June 2018. He is a fellow of the American Society of Mechanical Engineers, the National Academy of inventors, and the IEEE. Sammakia holds 21 U.S. patents and has published more than 250 peer-reviewed technical papers. Sammakia, who received the SUNY Chancellor’s Award for Excellence in Scholarship and Creative Activities in 2010, was honored with the 2010 ITherm Achievement Award for his contributions to the field of semiconductor thermal management. Sammakia earned his bachelor’s degree from the University of Alexandria in Egypt and his master’s and doctoral degrees from the University at Buffalo. A former IBM senior technical staff member, Sammakia joined Binghamton’s faculty in 1998.
Dr. Leila Choobineh, Co-Moderator, SUNY Polytechnic Institute, Utica, NY
Dr. Leila Choobineh is an assistant professor of Mechanical Engineering at SUNY Polytechnic institute. She received the Ph.D. degree (2014) in mechanical engineering from the University of Texas at Arlington. Her research interests include the development of micro- and nano-scale sensors, thermal management of 3D integrated circuits, microelectronics, flexible electronics, and microelectronics cooling. She had served as session chair, topic chair and track chair at IMECE, IEEE ITherm and InterPACK conferences during the last three years.
Dr. Gamal Refai-Ahmed, XILINX, San Jose, CA
Rahima Mohammed is a Senior Principal Engineer at Intel Corporation and currently leads the “Delight Customer Program Office” in the Performance, Power and Competitive Analysis team in Manufacturing Validation Performance (MVP) team of Intel.
Prior to this, she served as a Data Center Customer Solutions Technologist in Manufacturing Validation Engineering (MVE) and led the data mining efforts on customer returned parts. She has been with Intel over 19 years after graduate schooling from Yale. Before joining MVE, she served as the advanced test module technologist, path finding czar for strategic emerging technologies across market segments and also setup the innovation programs for the division. She also chairs various technical steering committees and serves on Industry advisory boards. She has published 100+ papers in Intel internal and external conferences and filed 5 patents. She serves as a reviewer for various conferences like ITherm, InterPACK, and a program committee member of IEEE Semi-therm conference and Burn-in-test strategies workshop. She served as the vice-program chair, program chair, and general chair of Semi-therm conferences in 2014, 2015, and 2016, respectively. Rahima has a strong passion for mentoring and coaching and hence, has served as the senior advisor for Women at Intel Network of Guadalajara, Mexico for the past 8 years, and a TechWomen technical mentor of 2011 and 2012. She has been working with GHC and AnitaB since 2011.
Dr. Abhijit Dasgupta, University of Maryland, College Park, MD
Abhijit Dasgupta is Jeong H. Kim Professor of Mechanical Engineering at the University of Maryland (UMD), with research experience in the microscale and nanoscale mechanics and reliability physics of engineered materials used in conventional and additively manufactured 3D flexible electronic packaging and intelligent microsystems. He holds a Ph.D. in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign (UIUC), and has been a principal investigator at the Center for Advanced Life Cycle Engineering (CALCE) at UMD for the past 30 years, conducting research in reliability physics, design for reliability, accelerated stress testing, and real-time health management. He is an ASME Fellow, past Chair of the ASME Electronic and Photonic Packaging Division (EPPD), current member of the ASME Design, Manufacturing and Materials Segment Leadership Team (DMM-SLT) and Reliability Topic Lead
Melany L. Hunt is the Dotty and Dick Hayman Professor of Mechanical Engineering.
Her research work involves transport and mechanics in multiphase systems, including granular material flows, booming sand dunes, dense liquid-solid flows, fluidized beds, powders, and porous materials. She received her bachelor's degree from the University of Minnesota, Minneapolis and her masters and doctorate from the University of California, Berkeley. After graduating from Berkeley, she began at Caltech as an assistant professor in 1988. At Caltech, she has served as vice chair of the Caltech faculty, as the executive officer of mechanical engineering (2002-07), and most recently as vice provost (2007-14). In the role of vice provost, she oversaw Caltech’s academic and educational programs, including offices supporting teaching, learning and outreach; accreditation; student-faculty programs; and institutional research and assessment. Since stepping down as vice provost, she has returned to full time teaching and research; she continues as one of Caltech’s Deputy Title IX coordinators.
Dr. Amy Fleischer is the Dean of the College of Engineering at the California Polytechnic State University (Cal Poly) in San Luis Obispo, CA.
Cal Poly Engineering offers 14 bachelor’s and 11 master’s degree programs and enrolls more than 6,000 students. She was at Villanova University for 18 years before moving to Cal Poly and received her Ph.D. in Mechanical Engineering from the University of Minnesota in 2000.
Dean Fleischer currently serves on the Executive Committee of ASME’s Electronics and Photonics Packaging Division and served as Chair of the ASME Heat Transfer Division K-16 Technical Committee on Electronics Thermal Management from 2009-2011. Dr. Fleischer was recognized as the ASME Electronics and Photonics Packaging Division (EPPD) 2010 Women Engineer of the Year and was awarded the 2011 ASME K-16/ EPPD Clock Award in recognition of her outstanding and continuing contributions to the science and engineering of heat transfer in electronics. She is an Associate Editor of the Journal of Heat Transfer and a past Associate Editor of the Journal of Electronic Packaging.
Dean Fleischer’s research interests include the broad topics of sustainable energy system design and thermal management of electronic systems. Recent research projects have included energy storage in phase change materials, waste heat recovery from data centers, development of energy absorbing building materials, and development of nano-enhanced materials including graphite nanofiber thermal interface materials.
Dr. Leslie Phinney is a Principal Member of Technical Staff at Sandia National Laboratories in Albuquerque, New Mexico.
Her research is focused on heat transfer, thermosciences, and microsystems, with an emphasis on microscale heat transfer, thermal analysis and simulation, thermal microactuators, experimental techniques, laser processing, adhesion in microsystems, and microelectromechanical systems (MEMS) reliability testing. She has an M.S. and Ph.D. in Mechanical Engineering from the University of California at Berkeley and a B.S. in Aerospace Engineering from the University of Texas at Austin. She is a Fellow of the American Society of Mechanical Engineers. She is a recipient of a National Science Foundation CAREER Award and a 2017 Society of Women Engineers Prism Award.
Jie Xue leads Cisco’s Technology and Quality organization, a global team responsible for delivering customer-driven quality and reliability solutions in support of all Cisco’s product portfolio.
The team drives a competitive advantage for Cisco by ensuring innovation and excellence in manufacturing technology, test and component engineering, advanced technology development, and closed-loop quality management. Prior to joining Cisco, Jie held several management and engineering positions at Motorola, Inc., working on R&D and product development. Jie is an IMAPS Fellow and IEEE Fellow. She also has published more than 90 technical papers, holds 15 patents. Jie holds a Bachelor of Science from Tsinghua University in Beijing, China and a Master of Science and PhD from Cornell University.