Program - Track Keynotes


Track Keynote Speakers

Track 1: Heterogeneous Integration: Micro-Systems with Diverse Functionality
Thursday, August 30, 2018
8:00am – 8:45am

Uma Krishnamoorthy

Uma Krishnamoorthy
Robert Bosch Research Technology Center
Sunnyvale, CA

Microsensors Research and Development at Bosch


Robert Bosch GmBH has the distinction of successfully transforming many technology innovations related to microelectromechanical systems (MEMS) into manufacturable products. Bosch has been both a pioneer and a global market leader in the MEMS sensor segment since 1995 and now delivers, through Bosch Sensortec, a complete range of MEMS sensors and solutions tailored for smartphones, tablets, wearable devices and IoT (Internet of Things) applications. Our current microsensor product portfolio includes 3-axis acceleration, gyroscope and geomagnetic sensors, integrated 6- and 9-axis sensors, environmental sensors, along with comprehensive software suites. Today, maintaining market leadership requires continued improvements to existing product lines while maintaining high standards of innovation through development of new products. In this talk, I will address both technical and non-technical challenges that lay in the path of R&D teams in creating both innovative and equally successful microsensor products.


Dr. Uma Krishnamoorthy is the Director of Robert Bosch Research Technology Center’s Microsensor System Technologies and Multiphysics Modeling Department in Sunnyvale, CA. She leads multiple teams of scientists and technology experts responsible for identifying and shaping innovations that enable and fuel Bosch’s future product lines and design space. Her department focus is in two areas: Intelligent sensing for Automotive, Consumer and IoT applications; Modeling & Simulation methodologies for Industrial Product Design. Her teams collaborate with academia and industry to develop innovative solutions for mobility, industry and energy technologies.

Dr. Krishnamoorthy has extensive experience in research and development within industrial, academic and national lab settings. Prior to joining Bosch in 2015, she worked at Sandia National Laboratory, Albuquerque, NM, on nano-g inertial sensors and optical sensors. Previously she worked at Stanford University’s E.L. Ginzton laboratory, focusing on optical microelectromechanical systems for telecommunications and spectroscopy applications. She holds B.S. EE and Ph.D. EE degrees from Drexel University, PA, and University of California, Davis, respectively.

Track 2: Internet of Things (IoT)


Scott Scheeler, VP at Cisco


As Vice President of Engineering in the Core Hardware Group at Cisco Systems, Scott Scheeler leads the Switching Hardware Engineering Team with his 25+ years of comprehensive expertise in bringing complex network and storage systems to market. The switching product lines include Catalyst (2K, 3K, 4K and 6K), Nexus (2K, 5K, 6K and 7K), MDS and SMB hardware platform development. The product lines account for more than 13B of Cisco's overall product revenue. In addition to product development, Scott works in conjunction with software development leaders, product marketing, and customers to drive product roadmaps and next generation architectures. In addition to the switching products, Scott oversees hardware engineering for the Internet of Things (IoT) group at Cisco. IoT is the network connection of people, process, data, and things where Cisco is a driving force in IoT innovation. Prior to the Common Hardware Group, Scott served as the VP/GM of Switching and Fabric Products in the Data Center Group. He was responsible for the development of the Nexus 7000 and MDS 9000 platforms including software and hardware development and quality assurance. During this time, the Switching and Fabric Products group received the Cisco Pioneer Award for N7K Standard & Gross Margin Focus. Before arriving to Cisco, Scott was with Enterasys Networks for nine years as the VP of Engineering and VP of Hardware Engineering. While with Enterasys, he was responsible for the hardware architecture and development of Enterasys' entire portfolio of switching and routing products. Originally from the East Coast, Scott received his B.S. in Electrical Engineering from Lehigh University located in Pennsylvania. After four years as a hardware design engineer, he studied at Southern New Hampshire University and received his MBA.

Track 3: Structural and Physical Health Monitoring
Wednesday, August 29, 2018
8:00am - 8:45am

Structural and Physical Health Monitoring: Industrialization of Electronics Architectures for IIoT/IoT and Wearables Products

Daniel Gemota

Daniel Gemota, Jabil, San Jose, CA


The acceleration of technology discovery and advancement (designs, materials, processes, and manufacturing equipment) is creating opportunities for new families of structural and physical health monitoring products. In addition, customers are demanding customizable solutions which is fueling manufacturing industry changes that must be addressed quickly. At a minimum, customers are expecting access to the most advanced technologies (flexible hybrid electronics, soft materials, energy harvesting components, etc.) and a turn-key agile manufacturing solution. They demand manufacturing options that provide end-product customization while maintaining access to scalable high volume, high mix production services that offer them flexibility to address speed to commercialization and market demand shifts.

The ability to successfully manufacture products that use novel materials, advanced processes, and unique equipment platforms requires disciplined innovation. Flexible hybrid electronics (FHE) offers functionality that provides product designers unbounded freedom to realize innovative products. An established supply chain and robust guidelines will assist designers to exercise FHE technologies to realize highly differentiated products. As FHE technology transitions from R&D Push to Product Designer Pull, it is critical for Standards Development Organizations (IPC, IEC, IEEE, etc.), Industry Trade Associations (SEMI, IPC, SGIA, etc.), and Innovation Institutes to establish several critical assets: 1) well developed supply chain (e.g. materials, equipment, and manufacturing platforms), 2) robust standard operating procedures (e.g. consumables storage, materials acceptance standards, certificates of compliance), 3) established design rules (e.g. flex, rigid-flex, ultra thin die), and 4) rigid manufacturing processes (e.g. handling and presentation of ultra thin die, processing environment – temperature, humidity) and equipment (e.g. pick & place, dispensing, curing, in-line/off-line inspection tools). These activities are necessary to ensure that FHE based products meet consumer demands for in-field performance.


Daniel Gamota is vice president of the Digital Engineering Services Organization at Jabil. He is leading several international sites that are developing and deploying hardware innovations in medical, industrial, energy, consumer, aerospace, automotive, and defense products.

Prior to joining Jabil, Gamota was director and fellow of the technical staff at Motorola. He was elevated to IEEE Fellow and was named a Dan Noble Fellow at Motorola (top 0.1% of engineers) for his contributions to the fields of manufacturing, microelectronics, nanotechnologies, and printed & flexible electronics.

Gamota earned a Ph.D. in Engineering from the University of Michigan and an M.B.A. from the Kellogg School of Management, Northwestern University.

Track 4: Gen3 Embedded Cooling for Wide Bandgap Power Amplifiers
Thursday, August 30, 2018

Bar-Cohen1, J. J. Maurer1, D. H. Altman2
1. Raytheon - Space and Airborne Systems, USA
2. Raytheon - Integrated Defense Systems, USA


Successful utilization of the inherent capability of wide bandgap materials and architectures for RF power amplifiers necessitates the creation of an alternative, Gen3, thermal management paradigm. Recent Gen3 “embedded cooling” efforts in the aerospace industry have focused on overcoming the near-junction thermal limitations of conventional electronic materials through the use of diamond substrates and enhancing removal of the dissipated power with on-chip convective and jet impingement microfluidics.

Following the introduction of a modified Johnson Figure-of-Merit (JFOM-k), which includes thermal conductivity to reflect this thermal limitation, attention is turned to the options, challenges, and techniques associated with the development of embedded thermal management technology. Record GaN-on-Diamond power fluxes, in excess of 500W/mm2, and heat fluxes, above 400W/mm2, achieved in DARPA’s NJTT program, are described. Raytheon’s ICECool demonstration MMICs, which achieved 3.1× the CW RF power output and 4.8× the CW RF power density relative to a baseline design, are used to illustrate the efficacy of Gen3 embedded cooling.

Avram Bar-Cohen, PhD
Principal Engineering Fellow
Raytheon – Space and Airborne Systems
Rosslyn, VA


Dr. Avram Bar-Cohen is an internationally recognized leader in thermal management of microelectronics, the IEEE Electronic Packaging Society President for 2018-2019 and Life Fellow of IEEE, as well as Honorary Member of ASME, and is currently serving as a Principal Engineering Fellow at Raytheon Corporation – Space and Airborne Systems His publications, lectures, short courses, and research, as well as his US government and Professional service in IEEE and ASME, have helped to create the scientific foundation for the thermal management of electronic components and systems. His current efforts focus on embedded cooling, including two-phase microchannel coolers, on-chip thermoelectrics, and diamond substrates for high heat flux electronic and photonic components in computational, radar, and directed energy systems.

Bar-Cohen is a former Editor-in-Chief of the IEEE CPMT Transactions and has represented the Society as a Distinguished Lecturer for more than 15 years. He recently completed his service as a Program Manager in the Microsystem Technology Office at the Defense Advanced Projects Agency in Virginia and had earlier served as Department Chair of Mechanical Engineering and Distinguished University Professor at the University of Maryland – College Park.

In 2014 Bar-Cohen was honored by the IEEE with the prestigious CPMT Field Award and had earlier been recognized with the CPMT Society’s Outstanding Sustained Technical Contributions Award (2002). Among other awards, Bar-Cohen received the Luikov Medal from the International Center for Heat and Mass Transfer in Turkey (2008) and ASME’s Heat Transfer Memorial Award (1999), Edwin F. Church Medal (1994), and Worcester Reed Warner Medal (1990).

In addition to serving as the Editor-in-Chief of WSPC’s Encyclopedia of Thermal Packaging and the co-editor of the Advanced Integration and Packaging book series, Bar-Cohen has co-authored Dielectric Liquid Cooling of Immersed Components (WSPC, 2013), Design and Analysis of Heat Sinks (Wiley, 1995), and Thermal Analysis and Control of Electronic Equipment (McGraw-Hill, 1983), and has edited/co-edited 28 other books in this field. He has authored/co-authored more than 400 journal papers, refereed proceedings papers, and chapters in books and has delivered some 100 keynote, plenary and invited lectures at major Conferences, Symposia, and college campuses throughout the world.

Track 5
Wednesday, August 29, 2018
8:00am – 8:45am

Paul E. Krajewski

Paul E. Krajewski
General Motors Global Research and Development Center
Detroit, MI

The Role of Prognostics in Future Transportation Systems


The ability to predict the failure of a system before it happens is critical to minimizing the impact of the event, whether the system is the human body, an airplane, or an automobile. In the future of transportation, “the system” will be more than a single vehicle, rather it will be an interdependent network of infrastructure, vehicles, and people. This talk will review recent advances in vehicle subsystem prognostics and discuss how these methods, in combination with new “big data” techniques, can be applied to the larger transportation ecosystem. Examples of transportation system failures and how prognostics may prevent them, will be reviewed. Opportunities for new development and initiatives will be presented.


Dr. Paul E. Krajewski is the Director of the Vehicle Systems Research Lab at the General Motors Global Research and Development Center. His laboratory is responsible for R&D in a variety of vehicle areas including aerodynamics, thermal systems, displays, interior systems, smart materials, vehicle health management (VHM), human machine interface (HMI), and user experience. Dr. Krajewski is a global expert in vehicle lightweighting and lightweight materials. He received his Bachelors and Doctorate in Materials Science and Engineering from the University of Michigan. He has led production implementations with aluminum, magnesium, and carbon fiber composites including body panels on the 2014 Corvette Stingray. Dr. Krajewski has over 75 publications and has been awarded 45 US Patents. He has been recognized by Fortune Magazine (40 under 40) and MIT’s Technology Review (TR100) as a leading innovator, and is a Fellow of ASM International. He has appeared as a subject matter expert on the History Channel's Modern Marvels Aluminum Program, won numerous automotive industry innovation awards, and recently published a children’s book entitled “Whats In Your Car”.