Program - Tutorials


August 27, 2018
8:00am – 8:45am

7-1 - Material Characterization for Harsh Environment Electronics
Monday, August 27, 2018
2:00pm – 3:30pm

Przemyslaw Jakub Gromala1, Fabian Welschinger2

1 Robert Bosch GmbH, Automotive Electronics, Engineering Design ECUs,
Product Optimization, Tübinger Strasse 123, 72762 Reutlingen, Germany

2 Robert Bosch GmbH, Corporate Sector Research and Advance Engineering,
Plastics Engineering, Robert-Bosch-Campus 1, 71272 Renningen, Germany


Epoxy-based polymers are widely used in the semiconductor industry as thermal and/or electrical interfaces and as encapsulating material. In the automotive industry, epoxy-based molding compounds (EMC) are often used to protect not only the single IC packages but also the entire electronic control units (ECUs) or the power modules. The stress caused by the mismatch of the coefficient of thermal expansion (CTE) between EMC and adjacent materials is one of the major causes for premature failure. In the temperature range of interest, the mold material used in the specific applications exhibits a highly nonlinear behavior. Especially around the glass transition temperature, a dominant nonlinear viscous characteristic of the mold material can be observed. During operation of the aforementioned applications, the epoxy-based polymers are subjected to elevated temperatures around the glass transition temperature, where the material exhibits significant volumetric and isochoric viscosity. In contrast, at low temperatures, epoxy-based polymers show an ideal elastic characteristic with brittle fracture behavior. This complex material characteristic in the full temperature range of interest renders the design of electronic control units a nontrivial task. Regarding an accelerated development process, the aforementioned material mechanisms have to be taken into account by suitable simulation strategies.

This training will addresses details of such strategies, summarizes the required material characterization procedure, and closes with some representative examples.

Przemyslaw Gromala


Mr Przemyslaw Gromala is a simulation senior expert at Robert Bosch GmbH, Automotive Electronics in Reutlingen. Currently leading an international simulation team and FEM validation lab with the main focus on implementation of simulation driven design for electronic control modules and multi-chip power packaging for hybrid drives. His research activities focus on virtual pre-qualification techniques for development of the electronic control modules and multi-chip power packaging. His technical expertise includes material characterization and modeling, multi-domain and multi-scale simulation incl. fracture mechanics, verification techniques and prognostics and health management for future safety related electronic smart systems.

Prior joining Bosch Mr Gromala worked at Delphi development Center in Krakow, as well as at Infineon research and development center in Dresden.

He holds a PhD in mechanical engineering from Cracow University of Technology in Poland.

Fabian Welschinger

 Mr. Fabian Welschinger is a research engineer at Robert Bosch GmbH, Corporate Sector Research and Advance Engineering in Renningen. His research focuses on the development and implementation of simulation methods for plastic materials including elastomers, reinforced thermoplastics, and epoxy-based materials. His technical expertise includes the investigation of failure mechanisms in (reinforced) plastic materials on different length scales, the transport of relevant information onto the component scale, and the development of nonstandard characterization techniques.

Prior joining Robert Bosch GmbH, Mr. Welschinger worked as a research associate at the Institute of Applied Mechanics, University of Stuttgart, Germany. He holds a PhD in Civil- and Environmental Engineering and the SimTech Cluster of Excellence from the University of Stuttgart.

7-2 - Reliability Considerations for Flexible Hybrid Electronics
Thursday, August 30, 2018
1:30pm – 3:00pm

Allyson Hartzel


The focus of this tutorial is the reliability of flexible hybrid electronics primarily in wearable systems. For the purpose of this talk, the system includes flexible interconnect, yet also the MEMS and sensors and packaging. The entire systems hierarchy must all be well designed, processed and without killer defects. This tutorial webinar will cover some of the newer MEMS and sensor devices with advanced packaging and flexible interconnects, and how to assess field failure mechanisms, identify failure mechanisms and statistically model reliability.


Ms. Allyson Hartzell is a Managing Engineer at Veryst Engineering with more than three decades of professional experience in emerging technologies. Ms. Hartzell is an internationally recognized expert in MEMS reliability and has expertise in surface chemistry and analytical techniques for failure analysis. Prior to joining Veryst Engineering, Ms. Hartzell was Director of Engineering for Reliability, Failure Analysis, and Yield at Pixtronix, a wholly owned subsidiary of Qualcomm. She was a Senior Staff Scientist in Reliability and Yield at Analog Devices Micromachined Products Division, and has worked at IBM and Digital Equipment Corporation. Allyson has a ScM in Applied Physics from Harvard University and an ScB from Brown University in Materials Engineering.

7-6 - How to Qualify Your Batteries to Prevent Failures and Thermal Events
Monday, August 27, 2018
2:00pm – 3:30pm


The rising demand for internet of things (IoT) and machine to machine (M2M) applications makes battery power an absolute necessity. However, reports about lithium ion batteries exploding and catching fire continue to draw the public's attention. How do you balance the need for power, size, cost, and time-to-market, while still avoiding being the lead story on the evening news?

Is it enough to qualify a cell manufacturer according to industry standards? The answer is that the majority of compliance-based testing is related to abuse tolerance. However, the vast majority of field failures do not occur under abuse scenarios, but happen under normal operating conditions due to manufacturing flaws or design and system tolerance issues that cause internal shorts. Internal shorts are unfortunately not mitigated by safety electronics.

In this Battery Tutorial, you will

  1. Gain an understanding of lithium ion battery failure mechanisms and the pathway to thermal runaway events
  2. Learn about the top causes of battery field failures, and the major areas where you need to have mitigation strategies
  3. Learn how cell design plays a critical role in battery safety and reliability, and what you can do from a design perspective to prevent these
  4. Learn the basic steps in a lithium ion cell manufacturing process, and the process controls required to ensure cell safety and reliability
  5. Learn about the battery management system and its role in system safety
  6. Come away with a checklist of things you should do to qualify your cell manufacturer - pass down requirements, trust but verify (design, manufacturing, compliance-based testing, system level tolerances, application specific battery testing, battery management system, cell CT scans and teardowns and lastly user education)
Vidyu Challa


Vidyu Challa is Technical Director at DfR Solutions, which she helps customers prevent battery problems from happening. Dr. Challa works on a range of battery challenges including design reviews, manufacturing audits, supplier qualification and root cause analysis. She spent several years in the battery industry, developing custom battery solutions for IOT and smart medical devices. She obtained a Ph.D. from the University of Maryland, where her work was focused on the reliability of electronic components. Dr. Challa teaches battery classes at conferences and frequently writes blog articles.

Monday, August 27, 2018
2:00 PM – 4:00 PM
ROOM: Mason I, Second Floor


The course contains the fundamentals of the thermal stress problem in electronic packaging. The emphasis is on the underlying reliability physics and predictive modeling. The objective of the course is to teach a down-to-earth mechanical, materials, electrical or an opto-electronics engineer of how to anticipate and prevent a possible thermal failure in his/her design. The instructor has worked in this field for many years, and some of his publications are indicated in the course information.

Ephraim Suhir


Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, and Technical University, Vienna, Austria. He is also CEO of the Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA. Ephraim is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); IEEE Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); and Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE). He is Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”. Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. This year Ephraim received the 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems.